MT29F Series NAND Flash Overview

MT29F NAND Flash Overview

MT29F NAND Flash

Overview of MT29F NAND Flash

Micron’s MT29F series NAND Flash offers storage capacities ranging from 32Gb to 256Gb, built on advanced 1Ynm/1Znm process technology. They support high-performance read and write operations. While these four products share identical electrical and functional specifications, the main differences lie in storage capacity and packaging type, making them suitable for applications from consumer electronics to industrial systems.

  • MT29F32G08CBABA – 32Gb MLC NAND, ideal for entry-level storage applications.
  • MT29F64G08CBABA – 64Gb MLC NAND, suitable for medium-capacity requirements.
  • MT29F128G08CBABA – 128Gb MLC NAND, high-capacity storage for multimedia data.
  • MT29F256G08CBABA – 256Gb MLC NAND, ultra-high capacity for high-performance industrial devices.

To learn more about our integrated circuits and memory products, please visit the ICs and Memory pages.

MT29F4G01ABAFD12-AAT:F TR
MT29F4G01ABAFD12-AAT:F
MT29F4G08ABAFAH4-IT:F TR
MT29F4G08ABAFAH4-AAT:F
MT29F4G08ABAFAH4-AAT:F TR
MT29F4G08ABAFAH4-IT:F
MT29F64G08CBABAWP-M:B
MT29F2G01ABAGDWB-IT:G
MT29F8G08ABACAH4-IT:C TR
MT29F8G08ABACAH4-IT:C
MT29F8G08ABACAH4-ITS:C
MT29F32G08CBABA
MT29F128G08CBABA
MT29F256G08CBABA

More about Faith New Dawn Limited

Key Features of MT29F NAND Flash

  • Wide Capacity Range: 32Gb, 64Gb, 128Gb, 256Gb
  • High Performance: Optimized sequential read/write speeds for embedded systems
  • Industrial Temperature Support: −40°C to 85°C (selected models)
  • Reliable Storage: Built-in Error Correction Code (ECC) for enhanced data integrity
  • Flexible Packaging Options: TSOP, FBGA (varies by capacity)
  • Low Power Consumption: Ideal for battery-powered and mobile devices

Key Specifications of MT29F NAND Flash

Feature

MT29F32G08CBABA

MT29F64G08CBABA

MT29F128G08CBABA

MT29F256G08CBABA

Capacity

32Gb

64Gb

128Gb

256Gb

NAND Type

MLC

MLC

MLC

MLC

Interface

x8 / x16

x8 / x16

x8 / x16

x8 / x16

Package

TSOP48

TSOP48

TSOP48

FBGA

Max Read Speed

25 MB/s

25 MB/s

25 MB/s

25 MB/s

Max Write Speed

12.5 MB/s

12.5 MB/s

12.5 MB/s

12.5 MB/s

Operating Temp

−40°C to 85°C

−40°C to 85°C

−40°C to 85°C

−40°C to 85°C

Endurance

3K P/E cycles

3K P/E cycles

3K P/E cycles

3K P/E cycles

⚠️ Note: The MT29F256G08CBABA uses FBGA solder ball packaging rather than traditional pins, suitable for automated soldering processes.

Applications of MT29F NAND Flash

  • Consumer Electronics: MP3/MP4 players, digital cameras, gaming consoles
  • Industrial Embedded Systems: PLCs, industrial controllers, IoT devices
  • Automotive Electronics: Infotainment systems, ADAS storage modules
  • Networking Equipment: Routers, switches, storage appliances

Why Choose Us

  • High Quality & Reliability: Strict screening and testing for industrial-grade NAND Flash
  • Flexible Capacity Options: Easily scale from 32Gb to 256Gb without redesign
  • Optimized Performance: Low latency and high endurance for critical applications
  • Professional Support: Technical guidance and application support from experienced engineers

FAQ

Q1: Are these four models electrically compatible?
A1: Yes, all four models share identical electrical specifications. Differences are mainly in capacity and package type.

Q2: Can MT29F256G08CBABA be used in standard TSOP sockets?
A2: No, MT29F256G08CBABA uses FBGA packaging and requires soldering onto a PCB with a BGA footprint.

Q3: Do these NAND Flash chips support industrial temperatures?
A3: Yes, all models operate from −40°C to 85°C.

Q4: What is the endurance rating for these NAND chips?
A4: All models have a typical endurance of 3,000 Program/Erase cycles (MLC).

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3 Comments

    1. Thanks for your kind words! We’re glad the MT29F Series overview has been helpful. We appreciate your willingness to contribute and help others too!

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