Description

XCZU28DR-2FFVG1517I Xilinx RFSoC FPGA Product Page

Product Overview

The XCZU28DR-2FFVG1517I is an AMD (Xilinx) Zynq UltraScale+ RFSoC device that integrates a processing system, programmable logic, and high-speed RF data converters in a single chip.

Designed for advanced signal-processing applications, this device combines embedded processing capabilities with FPGA-based hardware acceleration and integrated analog-to-digital and digital-to-analog conversion. It can help simplify system architecture, reduce external component requirements, and support high-bandwidth RF signal processing.

The device is suitable for communication infrastructure, radar systems, software-defined radio, and other applications requiring integrated RF conversion and programmable processing.

Key Technical Characteristics

• Product family: Zynq UltraScale+ RFSoC
• Device: XCZU28DR
• Programmable logic: Approximately 930K system logic cells
• Application processor: Quad-core Arm Cortex-A53
• Real-time processor: Dual-core Arm Cortex-R5
• RF ADC: 8 channels, 12-bit resolution, up to 4.096 GSPS
• RF DAC: 8 channels, 14-bit resolution, up to 6.554 GSPS
• Integrated RF data conversion and digital signal-processing resources
• Speed grade: -2
• Temperature grade: Industrial (I)
• Package: FFVG1517 flip-chip ball grid array (FCBGA)

Maximum converter sampling rates depend on the device specifications and operating conditions. Refer to the manufacturer’s datasheet for detailed electrical and performance limits.

Functional Behavior

The XCZU28DR combines RF conversion, programmable logic, and embedded processors to support high-speed data acquisition, signal generation, and real-time processing.

Key functional capabilities include:

• RF signal acquisition through integrated ADC channels
• RF signal generation through integrated DAC channels
• FPGA-based parallel processing and hardware acceleration
• Embedded application processing and real-time control
• Digital signal-processing pipelines
• Data exchange between the processing system and programmable logic
• Support for complex communication and RF processing architectures

By integrating these functions into a single device, the XCZU28DR can help reduce the need for separate RF converter and processing components in suitable system designs.

Package Information

• Package designation: FFVG1517
• Package type: Flip-chip ball grid array (FCBGA)
• Ball count: 1517
• Mounting method: Surface-mount technology (SMT)

The package provides electrical connections for power, ground, programmable logic I/O, processing system interfaces, RF converter functions, and other device interfaces.

For PCB footprint design, thermal management, and assembly requirements, consult the official package documentation.

Electrical and Operating Conditions

• Power supply: Multiple supply rails are required
• Core voltage: Depends on the applicable device power domain and operating configuration
• Temperature grade: Industrial (I)
• Speed grade: -2
• Configuration: Requires appropriate FPGA configuration and system initialization
• Thermal design: Must account for system workload, converter activity, and operating conditions

Power sequencing, clock configuration, I/O voltage compatibility, and thermal management should be considered during hardware development. Refer to the official datasheet for detailed operating limits.

Applications

• 5G wireless communication infrastructure
• Radar and RF signal-processing systems
• Software-defined radio (SDR)
• Wireless infrastructure and RF transceivers
• High-speed data acquisition equipment
• Electronic test and measurement systems
• Aerospace and defense signal-processing platforms
• FPGA-based RF processing systems

Application suitability depends on the required bandwidth, signal characteristics, processing workload, and overall system design.

FAQ

What type of chip is XCZU28DR-2FFVG1517I?

It is a Zynq UltraScale+ RFSoC that combines FPGA programmable logic, embedded processors, and high-speed RF data converters in one device.

What problems can this device help solve?

It can help engineers integrate RF signal conversion and digital processing, accelerate demanding signal-processing tasks, and reduce the number of separate components required in suitable system architectures.

Does the XCZU28DR include ADC and DAC functions?

Yes. The device integrates eight 12-bit RF ADC channels and eight 14-bit RF DAC channels. Maximum sampling rates depend on the applicable operating specifications.

Which processors are integrated into this device?

It includes a quad-core Arm Cortex-A53 application processing unit and a dual-core Arm Cortex-R5 real-time processing unit.

What does the FFVG1517 package designation indicate?

It identifies the package variant. The package uses a flip-chip ball grid array configuration with 1517 connections.

What do the -2 and I suffixes indicate?

The -2 identifies the speed grade, while I identifies the industrial temperature grade. Refer to the manufacturer’s documentation for the corresponding operating conditions.

Is this device suitable for 5G and radar applications?

It can support suitable 5G, radar, and other RF signal-processing designs. Actual suitability depends on system requirements, implementation, and performance constraints.

Can it replace a conventional FPGA and separate RF converters?

In suitable designs, its integrated RF converters, processing system, and programmable logic can reduce the need for separate devices. The final component selection depends on the application’s technical requirements.

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Technical Reference

For detailed specifications, electrical characteristics, and design requirements, refer to the official AMD documentation:

• Zynq UltraScale+ RFSoC Product Data Sheet (DS889)
• Zynq UltraScale+ RFSoC Data Sheet: DC and AC Switching Characteristics (DS926)
• ZCU111 Evaluation Board User Guide (UG1271)

This page is provided for product identification and technical reference. Product availability, condition, date code, and traceability should be confirmed separately.