AS4C512M16D3LB-12BINTR

Description

AS4C512M16D3LB-12BINTR

DDR3L SDRAM, 8Gb (512M x 16), 1.35V, 96-Ball FBGA, 800MHz, Industrial Temperature Grade, Tape & Reel packaging, B Die (MT41K512M16HA-125IT:A)

Product Specifications

• Manufacturer: Alliance Memory
• Product Category: Dynamic Random Access Memory (DRAM)
• RoHS Compliance: Yes
• Type: SDRAM – DDR3L
• Memory Capacity: 8 Gbit
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 800 MHz
• Package / Case: FBGA-96
• Organization: 512M x 16
• Access Time: 20 ns
• Minimum Supply Voltage: 1.283 V
• Maximum Supply Voltage: 1.45 V
• Minimum Operating Temperature: -40°C
• Maximum Operating Temperature: +95°C
• Series: AS4C512M16D3LB-12
• Package Type: Reel
• Brand: Alliance Memory
• Assembly Country: Not Available
• Country of Origin: Taiwan (TW), China (CN)
• Moisture Sensitivity Level: Yes
• Mounting Style: SMD / SMT
• Product Type: DRAM
• Subcategory: Memory & Data Storage
• Maximum Supply Current: 122 mA
• Factory Packing Quantity: 2000 units

Overview

The AS4C512M16D3LB-12 DDR3L SDRAM is a high-density 8Gb memory device configured as 512M x 16, designed for high-performance embedded and industrial applications. Operating at a low voltage of 1.35V with a maximum speed of 800MHz, it provides an excellent balance of power efficiency and data throughput. Packaged in a 96-ball FBGA form factor, it ensures compact design, strong signal integrity, and reliable long-term operation in demanding environments.

Key Features of AS4C512M16D3LB-12BINTR

• DDR3L low-voltage architecture (1.35V)
• High-density 8Gb (512M x 16) configuration
• High-speed operation up to 800MHz
• Industrial temperature grade support (-40°C to +95°C)
• 96-ball FBGA compact package
• Low power consumption with stable performance
• Optimized for embedded and industrial systems

Applications of AS4C512M16D3LB-12BINTR

• Industrial control systems
• Networking equipment
• Telecommunications infrastructure
• Embedded computing systems
• Automotive electronics
• High-performance storage systems
• IoT and edge computing devices

Why Choose Us:AS4C512M16D3LB-12BINTR

• Stable and tested supply chain for industrial-grade ICs
• Competitive pricing with global sourcing capability
• Strict quality inspection before shipment
• Fast and reliable international logistics support
• Long-term supply availability for production continuity

FAQ

Q1: What is DDR3L memory used for?
A1: DDR3L is widely used in embedded and industrial systems requiring low power consumption and stable high-speed memory performance.

Q2: What is the advantage of 1.35V DDR3L?
A2: It reduces power consumption and heat generation compared to standard DDR3, improving system efficiency and reliability.

Q3: Is this memory suitable for industrial environments?
A3: Yes, it supports industrial temperature ranges from -40°C to +95°C, making it suitable for harsh environments.

Q4: What is the package type of this IC?
A4: It uses a 96-ball FBGA package, which provides compact size and strong electrical performance.

Q5: What is the operating speed?
A5: The device supports up to 800MHz operation for high-performance applications.

Q6: What is the memory organization?
A6: It is organized as 512M x 16, providing efficient data handling and high density.

Q7: What applications is this product commonly used in?
A7: It is used in industrial automation, networking, telecommunications, embedded systems, and automotive electronics.

Q8: What is the factory packing quantity?
A8: The product is supplied in reel packaging with 2000 units per reel.

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