AS4C512M16D3LC-12BIN

Description

AS4C512M16D3LC-12BIN
Dynamic Random Access Memory (DDR3L), 8Gb, 512M x 16, 1.35V, 96-Ball FBGA, 800MHz, Industrial Temperature Range, Die (MT41K512M16HA-125IT:A)

Product Specifications

• Manufacturer: Alliance Memory
• Product Category: Dynamic Random Access Memory (DRAM)
• RoHS Compliance: Yes
• Type: SDRAM – DDR3L
• Memory Capacity: 8 Gbit
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 800 MHz
• Package / Case: FBGA-96
• Organization: 512M x 16
• Access Time: 20 ns
• Supply Voltage (Min): 1.283 V
• Supply Voltage (Max): 1.45 V
• Minimum Operating Temperature: -40°C
• Maximum Operating Temperature: +95°C
• Package Type: Tray
• Factory Packing Quantity: 190 units
• Brand: Alliance Memory
• Assembly Country: Not Available
• Country of Origin: Taiwan (TW), China (CN)
• Moisture Sensitivity Level: Yes
• Mounting Style: SMD / SMT
• Product Type: DRAM
• Subcategory: Memory & Data Storage
• Maximum Supply Current: 122 mA

Overview

The DDR3L 8Gb (512M x 16) Dynamic Random Access Memory is a high-performance, low-power SDRAM solution designed for industrial and embedded applications. Operating at 1.35V and supporting speeds up to 800MHz, it delivers stable performance, improved energy efficiency, and reliable data integrity. The device is packaged in a compact 96-ball FBGA and is suitable for systems requiring high-density memory and long-term reliability.

Key Features

• DDR3L low-voltage architecture for reduced power consumption
• High-density 8Gb (512M x 16) memory configuration
• Operating speed up to 800MHz
• Industrial temperature grade for harsh environments
• 96-ball FBGA compact package
• High stability and long operational life
• Optimized for embedded and industrial systems

Applications of AS4C512M16D3LC-12BIN

• Industrial control systems
• Networking equipment
• Telecommunications infrastructure
• Embedded computing systems
• Automotive electronics
• High-performance storage systems
• Consumer electronics

Why Choose Us:AS4C512M16D3LC-12BIN

• Stable and tested memory supply
• Competitive pricing and global sourcing capability
• Strict quality inspection before shipment
• Fast delivery and reliable logistics support
• Long-term supply chain support for industrial clients

FAQ:AS4C512M16D3LC-12BIN

Q1: What is DDR3L memory?
A1: DDR3L is a low-voltage version of DDR3 SDRAM operating at 1.35V, offering lower power consumption and improved thermal efficiency.

Q2: Is this 8Gb DDR3L suitable for industrial applications?
A2: Yes, it is designed for industrial-grade environments with stable performance and extended temperature support.

Q3: What is the organization of this memory chip?
A3: The memory organization is 512M x 16, providing high-density storage and efficient data access.

Q4: What is the operating speed of this device?
A4: The maximum speed is 800MHz, suitable for high-performance embedded and industrial systems.

Q5: What voltage does this DDR3L operate at?
A5: It operates at 1.35V, helping reduce power consumption compared to standard DDR3 memory.

Q6: What package type is used for this IC?
A6: It uses a 96-ball FBGA package, ensuring compact size and reliable mounting.

Q7: What temperature range does this memory support?
A7: It supports industrial temperature ranges from -40°C to +95°C.

Q8: What applications is this memory commonly used in?
A8: It is widely used in industrial control, networking equipment, telecommunications, embedded systems, and automotive electronics.

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