H5AN8G6NDJR-VKC DDR4 SDRAM Memory IC

  • Memory Type: DDR4 SDRAM
  • Density: 8Gb
  • Interface: x16 / x8 configuration (depends on module design)
  • Operating Voltage: 1.2V
  • Package Type: FBGA (Fine Ball Grid Array)
  • Temperature Range: Industrial / Commercial grade options (depending on variant)
  • Manufacturer: SK hynix
MT29F16G08CBABA
MT29F32G08CBABA
MT29F128G08CBABA
MT29F256G08CBABA
MT29F1G01ABBFDWB-IT:F
MT29F2G08ABAFAWP:F
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Description

H5AN8G6NDJR-VKC DDR4 SDRAM Memory IC

Overview of H5AN8G6NDJR-VKC

H5AN8G6NDJR-VKC is a high-performance DDR4 SDRAM memory IC manufactured by SK hynix. It is designed for use in computing systems, servers, and embedded applications requiring stable and efficient memory performance. With advanced DDR4 architecture, this chip delivers improved bandwidth, lower power consumption, and reliable data processing for modern memory modules.

Key Features of H5AN8G6NDJR-VKC

  • DDR4 SDRAM technology with high-speed data transfer
  • 8Gb memory density for efficient storage capacity
  • Low operating voltage (1.2V) for reduced power consumption
  • FBGA package for compact and stable mounting
  • Optimized signal integrity for reliable system performance
  • Suitable for high-performance and industrial-grade applications

Applications

  • Desktop and laptop memory modules
  • Server and data center systems
  • Networking and communication equipment
  • Industrial embedded systems
  • High-performance computing platforms

Why Choose Us

  • Genuine and original components supply chain
  • Strict quality inspection before shipment
  • Stable and long-term inventory support
  • Fast response for quotation and technical support
  • Global shipping capability for B2B customers

FAQ

Q1: Is H5AN8G6NDJR-VKC compatible with all DDR4 systems?
A1: It is compatible with DDR4-based memory architectures, but final compatibility depends on the motherboard design, memory controller, BIOS configuration, and module layout.

Q2: What is the operating voltage of this chip?
A2: It operates at 1.2V, which is the standard voltage for DDR4 SDRAM, ensuring lower power consumption and stable performance.

Q3: What packaging does this chip use?
A3: It uses FBGA (Fine Ball Grid Array) packaging, which provides high-density integration, improved thermal performance, and reliable electrical connections.

Q4: What industries commonly use this chip?
A4: It is widely used in server systems, desktop and laptop computers, industrial control systems, networking equipment, and embedded computing devices.

Q5: Is this chip suitable for server-grade applications?
A5: Yes, this DDR4 SDRAM is designed to support high-performance computing environments, including server and data center memory modules.

Q6: What is the typical data rate of this memory IC?
A6: The data rate depends on the module configuration, but DDR4 architecture generally supports high-speed bandwidth suitable for modern computing systems.

Q7: Can this chip be used for industrial environments?
A7: Yes, it is suitable for industrial applications where stable operation, long lifecycle, and consistent performance are required.

Q8: How can I ensure compatibility before purchasing?
A8: It is recommended to verify the part number, datasheet specifications, and system memory controller requirements before integration or bulk purchase.

H5AN8G6NDJR-VKC adopts a black epoxy resin package design, therefore it appears as a standard dark-colored chip. Since it is based on an FBGA packaging structure, it also features tiny solder balls arranged on the bottom of the chip. At the same time, this solder ball design not only allows direct mounting onto PCB through reflow soldering, but also improves connection stability and signal integrity. As a result, it is widely used in computing and memory systems that require high reliability.

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To learn more about our integrated circuits, please visit the ICs page.
For detailed information on memory products, please check our Memory ICs page.
DDR, DDR2, DDR3, DDR4, DDR5, DDR6: Features, Applications

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