MT53D512M32D2DS-053
Replacement / Alternative Parts
This device is considered a legacy LPDDR4 product and is no longer recommended for new designs.
Common replacements include LPDDR4X generation devices such as:
MT53E512M32 series (Micron LPDDR4X upgrade family)
Newer low power Micron LPDDR4X solutions with improved efficiency and bandwidth
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Description
MT53D512M32D2DS-053 Product Specification Summary
Overview
MT53D512M32D2DS-053 is a Micron LPDDR4 mobile DRAM device designed for high bandwidth and low power embedded applications.
It belongs to the Micron LPDDR4 SDRAM family used in mobile and embedded systems such as smartphones, tablets, and industrial platforms.
The device features a 16Gb density with a 512M × 32 internal organization, providing a 2GB memory solution optimized for compact and power sensitive designs.
Key Specifications of MT53D512M32D2DS-053
| Item | Specification |
| Manufacturer | Micron Technology |
| Memory Type | LPDDR4 SDRAM (Mobile DRAM) |
| Capacity | 16Gb (2GB) |
| Organization | 512M × 32 |
| Interface | LPDDR4 |
| Data Rate | Up to 3200 Mbps class (JEDEC LPDDR4 standard range) |
| Operating Voltage | 1.1V VDD2 / 1.8V VDDQ (LPDDR4 standard) |
| Package Type | 200-ball WFBGA |
| Operating Temperature | Commercial or Industrial grade depending on suffix (typically -40°C to +85°C for industrial versions) |
| Status | Legacy / Obsolete (replacement available in LPDDR4X series) |
Key Features of MT53D512M32D2DS-053
High bandwidth LPDDR4 architecture supporting multi-channel parallel access
Low power operation with reduced voltage compared to DDR3 and earlier memory generations
High density 16Gb design enabling compact system integration
Advanced bank group architecture improving memory efficiency and throughput
On-die termination and training features including CA training and write leveling
Optimized for mobile and embedded systems requiring stable and efficient memory performance
Package and Architecture
Package type is 200-ball WFBGA fine pitch BGA used for mobile DRAM integration
Ball pitch is typically 0.5 mm (standard for this package class, exact value depends on official datasheet)
Internal architecture is dual x16 channels combined into a x32 data interface
LPDDR4 signaling includes CA, CK, DQS, and DQ groups for high-speed operation
Applications of MT53D512M32D2DS-053
Smartphones and mobile devices
Tablets and portable computing devices
AI edge computing and embedded processors
5G communication and networking equipment
Automotive infotainment systems depending on grade selection
Industrial embedded control systems
It is widely used in existing platforms but is now classified as a legacy product, with LPDDR4X series devices recommended for new designs.
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