MT53E1G16D1ZW-046 WT:C
Key Specifications
- Memory Type: LPDDR4X SDRAM (Low Power Mobile Memory)
- Capacity: 16Gb (2GB class)
- Application: Mobile device system memory (System RAM)
- Data Rate: Up to 3200–4266 MT/s (depending on system configuration)
- Operating Voltage: Around 1.1V
- Architecture: High-speed DDR architecture
- Power Characteristics: Low-power optimized design for mobile operation
- Package Type: BGA (Ball Grid Array)
- Mounting Method: SMT (Surface Mount Technology)
- Performance Characteristics: High bandwidth, low latency, stable operation
We support Escrow payment and bank transfer (T/T). With Escrow, funds are held by a third-party platform and only released after you confirm receipt of the goods, ensuring transaction security.
Description
MT53E1G16D1ZW-046 WT:C
MT53E1G16D1ZW-046 WT:C is a mobile DRAM memory chip based on LPDDR4X (Low Power DDR4X) technology. It is designed for high-speed data storage and system operation in mobile electronic devices.
This product is a standard mobile memory solution featuring low power consumption, high bandwidth, and a compact package design, making it suitable for space- and power-sensitive electronic systems.
Key Features of MT53E1G16D1ZW-046 WT:C
- Memory type: LPDDR4X SDRAM
- Application: Mobile low-power high-speed memory
- Architecture: Mobile DRAM (Low Power DDR series)
- Characteristics: Low voltage operation, high data bandwidth, energy-efficient design
- Compliance: Industry-standard mobile memory specification
Package Information:MT53E1G16D1ZW-046 WT:C
- Package type: BGA (Ball Grid Array)
- Form factor: Compact high-density package design
- Mounting type: SMT surface-mount technology
Applications of MT53E1G16D1ZW-046 WT:C
- Smartphones
- Tablets
- Thin and light mobile computing devices
- Embedded electronic systems
- Low-power high-speed memory applications
FAQ:MT53E1G16D1ZW-046 WT:C
1. What type of product is this?
It is an LPDDR4X low-power mobile DRAM memory chip used for system memory in electronic devices.
2. What devices is it used in?
It is commonly used in smartphones, tablets, ultrathin laptops, and embedded systems.
3. What is the difference between LPDDR4X and standard DDR memory?
LPDDR4X is designed for mobile devices with lower power consumption while maintaining high bandwidth performance.
4. What are its main advantages?
Its main advantages include low power consumption, high bandwidth, compact package design, and stable operation in mobile systems.
5. What package type does it use?
It uses a BGA (Ball Grid Array) package suitable for high-density PCB assembly.
6. Can it be used for repair or replacement?
It can be used for repair or replacement only when the exact model matches the system design, and it typically requires professional SMT or rework equipment.
7. Does it require special soldering?
Yes, BGA packages require professional SMT or rework equipment for proper installation.
8. Is this a high-performance memory chip?
It is a mobile memory chip designed to balance performance and power efficiency for portable electronic devices.
Learn more about our electronics on our website!
Visit our YouTube channel here!!
Reviews
There are no reviews yet.