SDINBDG4-8G-XI1
SDINBDG4-8G-XI1 is a compact rectangular BGA package eMMC chip with a flat black body and no visible pins, designed for surface mount assembly.
SanDisk eMMC
8GB embedded flash
managed NAND storage
eMMC memory chip
industrial storage device
SDINBDG4-8G-XI1 is an 8GB managed NAND Flash storage device with an integrated controller and eMMC interface designed to provide reliable non-volatile storage for embedded and industrial electronic systems
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Description
SDINBDG4-8G-XI1 8GB eMMC Embedded Flash SanDisk Storage Device
Overview SDINBDG4-8G-XI1
SDINBDG4-8G-XI1 is an embedded flash storage device manufactured by SanDisk
It is a non-volatile storage solution that integrates NAND Flash memory with an internal controller responsible for data management error correction and interface communication The device retains stored information even when power is removed making it suitable for embedded systems requiring stable and compact storage
With an eMMC compatible interface it simplifies system integration compared to raw NAND Flash and provides improved reliability through built-in management features
SDINBDG4-8G-XI1 Product Specifications
| Parameter | Value |
| Manufacturer | SanDisk |
| Brand | SanDisk |
| Trade Name | iNAND |
| Series | iNAND 7250 |
| Product Type | eMMC Embedded Flash Memory |
| Memory Type | Managed NAND (eMMC) |
| Storage Capacity | 8 GB |
| NAND Configuration | MLC |
| Interface Type | eMMC 5.1 HS400 |
| Sequential Read Speed | Up to 300 MB/s |
| Sequential Write Speed | Up to 40 MB/s |
| Sustained Read Speed | 300 MB/s |
| Sustained Write Speed | 40 MB/s |
| Supply Voltage Min | 2.7 V |
| Supply Voltage Max | 3.6 V |
| Operating Temperature Min | -40°C |
| Operating Temperature Max | +85°C |
| Package Type | BGA (nonstandard module package) |
| Mounting Style | SMD SMT |
| Dimensions | 11.5 mm × 13 mm × 0.8 mm |
| Factory Pack Quantity | 152 units |
| Unit Weight | 6.279 g |
| Moisture Sensitivity | Yes (typical for BGA NAND modules) |
| Subcategory | Memory and Data Storage |
| Country of Origin | China (as declared by supplier, may vary by batch) |
| Assembly Country | Not Available |
| Distribution Country | Not Available |
Key Features
Managed NAND Flash storage with integrated controller
Non-volatile data retention
eMMC compatible interface for simplified design
Built-in error correction and data management
Compact BGA package for space-efficient applications
Stable and reliable performance for embedded systems
Key Specifications SDINBDG4-8G-XI1
Memory Type Managed NAND Flash
Storage Capacity 8GB
Interface eMMC compatible
Voltage Low-voltage operation typical embedded range
Package Type BGA variant dependent
Temperature Grade Industrial or extended grade depending on variant
Applications
Embedded systems
Industrial control equipment
Consumer electronics
IoT devices
Automotive infotainment systems
Data logging and storage modules
Why Choose SDINBDG4-8G-XI1
Integrated controller reduces development complexity
Improved reliability compared to raw NAND Flash
Compact design suitable for space-constrained systems
Cost-effective embedded storage solution
Industry-standard interface for wide compatibility
FAQ SDINBDG4-8G-XI1
1 What is the difference between this device and raw NAND Flash
This device integrates a controller that manages data storage error correction and wear leveling while raw NAND Flash requires an external controller to perform these functions
2 Is this device compatible with standard eMMC interfaces
Yes it is designed to work with eMMC compatible host controllers commonly used in embedded systems
3 What are the advantages of using managed NAND storage
Managed NAND simplifies design reduces firmware complexity and improves reliability through built-in data management functions
4 Can this device be used as a boot storage device
Yes it is commonly used to store operating systems bootloaders and application firmware in embedded platforms
5 Does it support data retention after power loss
Yes it is a non-volatile memory device and retains stored data without power
6 What factors should be considered when integrating this device
Key considerations include interface compatibility power supply design PCB footprint and system-level firmware support
7 Is it suitable for industrial environments
Yes variants are typically designed for extended or industrial temperature ranges depending on specific configuration
8 How does it improve system reliability
The internal controller performs error correction bad block management and wear leveling which helps extend device lifespan and maintain data integrity
9 What is the typical package form factor
It is commonly provided in a compact BGA package suitable for high-density PCB layouts
10 Can it replace other storage solutions such as SPI Flash or SD cards
It can replace or complement other storage solutions depending on system requirements especially when higher capacity and integrated management are needed
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